l features l outline ? surface mount lans leds ? narrow directivity and high brightness ? availability of reverse mounting l size l dimensions l recommended solder pattern l specifications typ. i f min.* 2 typ. max.* 2 i f typ. i f (v) (ma) (nm) (nm) (nm) (ma) (mcd) (ma) sml-s13vt 625 630 635 450 sml-s13ut 615 620 625 700 sml-s13dt 602 605 608 sml-s13yt 587 590 593 sml-s13mt 569 572 575 400 sml-s13pt 557 560 563 160 smls14eet 3.3 520 527 538 3000 smls14bet 3.2 464 470 476 800 * 1 : duty 1/10, 1khz * 2 : reference 100* 1 1.9 2 forward voltag v f part no. chip structure absolute maximum ratings (ta=25oc) electrical and optical characteristics (ta=25oc) operating temp. topr(oc) power peak forward current i fp (ma) 20 20 20 - 40 to + 85 luminous intensity i v 1400 dominant wavelength l d storage temp. sml-s1 series yellowis h green forward current p d (mw) i f (ma) dissipation color emitting tstg(oc) - 40 to + 100 - 40 to + 85 ingan aigainp green bluish green 117 78 75 30 red orange yellow blue tolerance : ? 0.1 (unit : mm) 3216 1206 size 3.2 1.6mm t=1.85mm color type v u d y m p e b (unit : mm) surface mount back mount 1/8 2014.12 - rev.b data sheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. ( 1 . 6 ) (2) (4.6) 2.1 5.1 2 . 3 1 . 6
sml-s1 series l electrical characteristics curves fig.1 forward current - forward voltage s forward current : i f [ma] forward voltage : v f [v] fig.2 luminous intensity - atmosphere temperature relative luminous intensity [a.u.] atmosphere temperature : ta [oc] fig.3 luminous intensity - forward current forward current : i f [ma] fig.4 derating ambient temperature : ta [oc] ta=25 oc ta=25 oc i f = 20ma sml - s13vt sml - s13ut sml - y13dt sml - s13yt sml - s13mt sml - s13pt sml - s13vt sml - s13ut sml - y13dt sml - s13yt sml - s13mt sml - s13pt sml - s13vt sml - s13ut sml - y13dt sml - s13yt sml - s13mt sml - s13pt sml - s13vt sml - s13ut sml - y13dt sml - s13yt sml - s13mt sml - s13pt relative luminous intensity [a.u.] maximum forward current : i f [ma] 2/8 2014.12 - rev.b www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet 100 10 1 1.6 1.8 2.0 2 .2 0.2 -40 -20 0 2 0 4 0 6 0 8 0 1 00 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0 5 10 15 30 25 20 1.5 1.0 0.5 0 0 40 30 20 10 -40 -20 0 2 0 4 0 6 0 8 0 1 00
sml-s1 series l electrical characteristics curves fig.1 forward current - forward voltage s forward current : i f [ma] forward voltage : v f [v] fig.2 luminous intensity - atmosphere temperature relative luminous intensity [a.u.] atmosphere temperature : ta [oc] fig.3 luminous intensity - forward current relative luminous intensity [a.u.] forward current : i f [ma] fig.4 derating maximum forward current : i f [ma] ambient temperature : ta [oc] ta=25 oc ta=25 oc i f = 20ma smls14eet smls14bet smls14eet smls14bet smls14eet smls14bet smls14eet smls14bet 3/8 2014.12 - rev.b www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet 100 10 2.0 2.5 3.0 3 .5 4.0 1 0 5 10 25 15 30 20 1.5 1.0 0.5 0 -40 -20 0 2 0 4 0 6 0 8 0 1 00 0.6 1.4 1.2 1.0 0.8 0 40 30 20 10 -40 -20 0 2 0 4 0 6 0 8 0 1 00
sml-s1 series l viewing angle l rank reference of brightness scanning angle (deg) relative intensity scanning angle (deg) relative intensity x - y x' - y' 4/8 2014.12 - rev.b www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet 10 10 20 20 40 50 70 80 40 50 70 80 0 5 0 100 50 100 0 30 60 90 30 60 90 x - y x ' - y ' 10 10 20 20 40 50 70 80 40 50 70 80 0 5 0 100 50 100 0 30 60 90 30 60 90 x -y x '-y ' red(v, u) (ta=25oc, i f h 20ma ) g h j k l m n p q r s t u v w x y z 1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600 1600 to 2500 2500 to 4000 orange( d) (ta=25oc, i f h 20ma ) g h j k l m n p q r s t u v w x y z 1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600 1600 to 2500 2500 to 4000 yellow(y) (ta=25oc, i f h 20ma ) g h j k l m n p q r s t u v w x y z 1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600 1600 to 2500 2500 to 4000 green (m, p) (ta=25oc, i f h 20ma ) g h j k l m n p q r s t u v w x y z 1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600 1600 to 2500 2500 to 4000 blue (b) (ta=25oc, i f h 20ma ) r1 r2 s1 s2 t1 t2 u1 u2 v1 v2 w1 w2 x1 x2 y1 y2 z1 z2 56 to 71 71 to 90 90 to 110 110 to 140 140 to 180 180 to 220 220 to 280 280 to 360 360 to 450 450 to 560 560 to 710 710 to 900 900 to 1100 1100 to 1400 1400 to 1800 1800 to 2200 2200 to 2800 2800 to 3600 rank iv (mcd) sml-s13bt rank iv (mcd) sml-s13vt sml-s13ut rank iv (mcd) sml-s13dt rank sml-s13mt sml-s13pt iv (mcd) sml-s13y t rank iv (mcd)
sml-s1 series l part no. construction l packing specification rohm led products are being shipped with desiccant (silica gel) concluded in moisture-proof bags. pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card inside the bag is available upon request.
please contact the nearest sales office or distributer if necessary. 5/8 2014.12 - rev.b www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
6/8 1.storage if the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand which will influence the performance of the product. therefore, the package is waterproof. please use the product following the conditions: ? using conditions classification temperature humidity expiration date remark 1 before using 5 to 30oc 30 to 70%rh within 1 year from receiving storage with waterproof package 2 after opening package 5 to 30oc below 70%rh within168h please storing in the airtight container with our desiccant (silica gel) ? baking bake the product in case of below: 1 the expiration date is passed. 2 the color of indicator (silica gel) turned from blue to colorless or from green to pink. (even if the product is within the expiration date.) ? baking conditions temperature time humidity 603oc 12 to 24h below 20%rh remark ? bake products in reel. ? reel and embossed tape are easy to be deformed when baking, so please try not to apply stress on it. ? recommend bake once. 2.application methods 2-1. precaution for drive system and off mode design the circuit without the electric load exceeding the absolute maximum rating that applies on the products. if drive by constant voltage, it may cause current deviation of the led and result in deviation of luminous intensity, so we recommend to drive by constant current. (deviation of vf value will cause deviation of current in led.) furthermore, for off mode, please do not apply voltage neither forward nor reverse. especially, for the products with the ag-paste used in the die bonding, theres high possibility to cause electro migration and result in function failure. 2-2. operation life span theres possibility for intensity of light drop according to working conditions and environments (applied current, surrounding temperature and humidity, corrosive gases), please call our sales staffs for inquiries about the concerned application below. 1 longtime intensity of light life 2 on mode all the time 2-3.applied stress on product the top of the led is very soft, which the silicon resin is used as sealing resin. therefore, please pay attention to the overstress on it which may influence its reliability. 2-4.usage the product is led. we are not responsible for the usage as the diode such as protection chip, rectifier, switching and so on. www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet sml-s1 series 2014.12 - rev.b l precaution (surface mount device)
7/8 3. others 3-1. surrounding gas notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of the plating surface ) or optical characteristics changes (light intensity, chrominance) and change in quality of die bonding (ag-paste) materials. all of the above will cause function failure of the products. therefore, please pay attention to the storage environment for mounted product (concern the generated gas of the surrounding parts of the products and the atmospheric environment). 3-2. electrostatic damage the product is part of semiconductor and electrostatic sensitive, theres high possibility to be damaged by the electrostatic discharge. please take appropriate measures to avoid the static electricity from human body and earthing of production equipment. the resistance values of electrostatic discharge (actual values) vary with products, therefore, please call our sales staffs for inquiries. 3-3. electromagnetic wave please concern the influence on led in case of application with strong electromagnetic wave such as ih (induction heating). 4.mounting 4-1. soldering ? no resin hardening agent such as filler is used in the sealing resin of the product. therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence on the products reliability. ? the product is not for flow soldering. ? do not expose the product in the environment of high temperature (over 100oc) or rapid temperature shift (within 3oc of temperature gradient) during the flow soldering of surrounding parts. ? please set appropriate reflow temperature based on our product usage conditions and specification. ? the max for reflowing is 2 times, please finish the second flow soldering and flow soldering with other parts within the usage limitation after open the moistureproof package. ? compare with n2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the discoloration of the resin. ? for our product that has no solder resist, because of its solder amount and soldering conditions, one of its specific characteristics is that solder will penetrate into led. thus, there's high possibility that will influence its reliability. therefore, please be informed, concerning it before using it. 4-2. automatic mounting 4-2-1.silicon resin sealing product the sealing resin of led is very soft, so please select adsorption nozzle that would not apply stress directly on the sealing section. 4-2-2.mini package (smaller than 1608 size) vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover tape. we recommend to ? set magnet on parts feeder cassette of the mounter to control the product stabilization ? set ionizer to prevent electrostatic charge 4-3. mounting location the stress like bending stress of circuit board dividing after mounting, may cause led package crack or damage of led internal junction, therefore, please concern the mounting direction and position to avoid bending or screwing with great stress of the circuit board. www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet sml-s1 series 2014.12 - rev.b
(1.6) (1.8) (4.6) b>c>d the mechanical stress may damage the led after circuit mounting, so please pay attention to the touch on www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet sml-s1 series 2014.12 - rev.b
r1 102 a www .rohm.com ? 2014 rohm co., ltd. all rights reserved. notice rohm c u stomer support sys tem h ttp://w w w . r ohm .com/con tact/ thank you for your accessing to rohm pr oduct informations. mor e detail pr oduct informations and catalogs ar e available, please contact us. notes the inf or mation contained herein is subject to change without notic e . bef ore y ou use our p r o d u c t s , ple a s e c o n t a c t o u r s a l e s r e p r e s e n t a t i v e and v e r i f y the l a test specifica- tions : althoug h r o h m is c o n t i n uousl y w o r king t o impro ve p roduct r elia bility and quality , semicon- duc tors c an brea k do w n and mal f unction due to va r ious f actor s . the ref o r e , i n ord e r to p r e ve n t per sonal i n jur y or fire a r isin g f rom f a ilure , please tak e saf ety meas ure s suc h a s c o m plying wit h the der ating cha r a cte r istics , imple menting redundant and f ire p r e ve nti o n d e s i g n s , and u tilizing bac k ups a nd f ail- saf e p rocedures . r o hm shall h a ve no responsibility f or an y damages ar ising out of the use of our p oducts beyond the r ating specified b y r ohm. examples of application circuits , circuit constants and an y other inf or mation contained herein are pro vided only to illustr ate the standard usage and oper ations of the products . the per iphe r al conditions m ust be tak en into account when designing circuits f or mass production. the technical inf or mation specified herein is intended only to sho w the typical functions of and e xamples of application circuits f or the products . r ohm does not grant y ou, e xplicitly or implicitl y , an y license to use or e x ercise intellectual prope r ty or other r ights held b y r ohm or an y other par ties . r ohm shall ha v e no responsibility whatsoe v er f or an y dispute ar ising out of the use of such technical in f or mation. the products are intended f or use in gene r al electronic equipment (i.e . a v/o a de vices , comm uni- cation, consumer systems , gaming/ente r tainment sets) as w ell as the applications indicated in this document. the products specified in this document are not designed to be r adiation tole r ant. f or use of our products in applications requi r ing a high deg ree of reliability (as exemplified bel o w), please contact and consult with a r ohm representati v e : tr anspo r tation equipment (i.e . cars , ships , tr ains), pr imar y comm unication equipment, tr affic lights , fire/cr ime pre v ention, saf ety equipment, medical system s , ser v ers , solar cells , and po w er tr ansmission system s . do not use our products in applications requir ing e xtremely high reliabilit y , such as aerospace equipment, n uclear p o w er control systems , and submar ine repeater s . r ohm shall ha v e no responsibility f or an y damages or inju r y ar ising from non-compliance with the recommended usage conditions and specifications contained herein. r ohm has used reasona b le care to ensur the accur acy of the inf or mation contained in this document . ho w e v er , r ohm does not w arr ants that such inf or mation is error-free , and r ohm shall ha v e no responsibility f or an y damages ar ising from an y inaccu r acy or mispr int of such inf or mation. please use the products in accordance with an y applica b le en vironmental la ws and regulation s , such as the rohs directiv e . f or more details , including rohs compatibilit y , please contact a r ohm sales office . r ohm shall ha v e no responsibility f or an y damages or losses resulting non-compliance with a n y applica b le la ws or regulation s . when pro viding our products and technologies contained in this document to other countr ies , y ou m ust abide b y the procedures and pro visions stipulated in all applica b le e xpor t la ws and regulation s , including without limitation the us expor t administr ation regulations and the f oreign exchange and f oreign t r ade act. this document, in par t or in whol e , ma y not be repr inted or reproduced without pr ior consent of r ohm. 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) 12) 13) 14)
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